TAB/PCB 本壓重修機
本設備為專為LCM之修理工程所規劃的TAB及PCB重修設備，由人工自行針對Cell與TAB及PCB作再生刮除修理,再將Cell端子面回路與TAB及PCB端子面回路，於本設備作對位後行TAB壓著及PCB壓著動作。(Cell 呎吋由客戶自訂，目前做至65英吋)
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| 項目 | 規格內容描述 |
| Applicable Glass thickness | 0.4 ~ 1.1mm |
| Work side | 3 sides，Stage turn ±90°，manual by pin for cell each side setting X-Y position. |
| Applicable bonding position | 1 ~ 20 position / Cell side |
| Bonding position set per alignment | 1 ~ 20 position / alignment |
| Pressure/Flow/Tubing size | 5~6㎏/cm2，250L/min，φ12 |
| Vacuum/Flow/Tubing size | -80Kpa，60L/min，φ10 |
| Exhaust/ Tubing size | 100 L/min，φ8 |
| Bonding position move | X axis：servo motor + LM guide Y axis：servo motor + LM guide θaxis：D.D motor |
| TAB bonding Time setting | 0.1~ 30.0sec(0.1sec step) |
| TAB bonding Thrust force range | 3 ~ 35kgf，0.1 kgf step，accuracy :≦±5%. |
| PCB bonding Time setting | 0.1~ 30.0sec(0.1sec step) |
| PCB bonding Thrust force range | 5 ~ 55kgf, 0.1 kgf step, accuracy :≦±5%. |