TAB/PCB 本壓重修機

本設備為專為LCM之修理工程所規劃的TAB及PCB重修設備，由人工自行針對Cell與TAB及PCB作再生刮除修理,再將Cell端子面回路與TAB及PCB端子面回路，於本設備作對位後行TAB壓著及PCB壓著動作。(Cell 呎吋由客戶自訂，目前做至65英吋)

項目	規格內容描述
Applicable Glass thickness	0.4 ~ 1.1mm
Work side	3 sides，Stage turn ±90°，manual by pin for cell each side setting X-Y position.
Applicable bonding position	1 ~ 20 position / Cell side
Bonding position set per alignment	1 ~ 20 position / alignment
Pressure/Flow/Tubing size	5~6㎏/cm2，250L/min，φ12
Vacuum/Flow/Tubing size	-80Kpa，60L/min，φ10
Exhaust/ Tubing size	100 L/min，φ8
Bonding position move	X axis：servo motor + LM guide Y axis：servo motor + LM guide θaxis：D.D motor
TAB bonding Time setting	0.1~ 30.0sec(0.1sec step)
TAB bonding Thrust force range	3 ~ 35kgf，0.1 kgf step，accuracy :≦±5%.
PCB bonding Time setting	0.1~ 30.0sec(0.1sec step)
PCB bonding Thrust force range	5 ~ 55kgf, 0.1 kgf step, accuracy :≦±5%.