COG重修機 - 億尚

COG重修機

本設備主要針對IC不良重修工程與小量生產之用。作業時，針對IC與玻璃線路，於精細對位後壓著接合之用。

項目	規格內容描述
Glass thickness	0.4 ~ 1.1 mm
Tact time	1.≦46 sec/ 1 chip / 6”LCD(Include chip bonding alignment) 2.Base on bonding time is 12 sec.
Working side	1
Applicable Chip position	1~8 chips/side
Applicable chip size (L * W * T)	8.01.00.4.mm ~ 22.03.00.8mm
Chip outer dimension tolerance	L&W：±0.05mm; T：±0.03mm
Pre bond accuracy	X=±5μm，Y：±5μm (Bonding time0.5sec)
Final bond accuracy	X：±7μm，Y：±7μm (Bonding time up then 10sec)
Time setting	0.1~30sec(0.1sec step)
Heating type	Constant heating
Heat head temperature setting	Surface temp: R.T~400℃, 1℃ step, accuracy :±3℃
Head over heat protection	1.Thermocouple monitoring 2. Heater & thermocouple broken auto detect function.
Bonding temperature profile	up to 90% temperature≦1sec (without cushion)
Thrust force range	2 ~ 30kgf, 0.1 kgf step, accuracy :±5%.
Force setting method	Setting the numeric value in touch panel, and setting by side.
Heat head surface flatness	±2μm (At setting temperature range and within head length)
Tray loading repeated accuracy	±0.2mm
Clean room class	≤ Class 10000
Tact time:	≦ 46 sec