COG重修機
本設備主要針對IC不良重修工程與小量生產之用。作業時，針對IC與玻璃線路，於精細對位後壓著接合之用。
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| 項目 | 規格內容描述 |
| Glass thickness | 0.4 ~ 1.1 mm |
| Tact time | 1.≦46 sec/ 1 chip / 6”LCD(Include chip bonding alignment) 2.Base on bonding time is 12 sec. |
| Working side | 1 |
| Applicable Chip position | 1~8 chips/side |
| Applicable chip size (L * W * T) | 8.0*1.0*0.4.mm ~ 22.0*3.0*0.8mm |
| Chip outer dimension tolerance | L&W：±0.05mm; T：±0.03mm |
| Pre bond accuracy | X=±5μm，Y：±5μm (Bonding time0.5sec) |
| Final bond accuracy | X：±7μm，Y：±7μm (Bonding time up then 10sec) |
| Time setting | 0.1~30sec(0.1sec step) |
| Heating type | Constant heating |
| Heat head temperature setting | Surface temp: R.T~400℃, 1℃ step, accuracy :±3℃ |
| Head over heat protection | 1.Thermocouple monitoring 2. Heater & thermocouple broken auto detect function. |
| Bonding temperature profile | up to 90% temperature≦1sec (without cushion) |
| Thrust force range | 2 ~ 30kgf, 0.1 kgf step, accuracy :±5%. |
| Force setting method | Setting the numeric value in touch panel, and setting by side. |
| Heat head surface flatness | ±2μm (At setting temperature range and within head length) |
| Tray loading repeated accuracy | ±0.2mm |
| Clean room class | ≤ Class 10000 |
| Tact time: | ≦ 46 sec |